Multi-part lead frame with dissimilar materials
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 27, 2003
Issued Date -
N/A
app pub date -
Nov 16, 1999
filing date -
Oct 25, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully