Multi-gate device and method of fabrication thereof

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United States of America Patent

PATENT NO 10008603
SERIAL NO

15355844

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Abstract

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A method of fabrication of a multi-gate semiconductor device that includes providing a fin having a plurality of a first type of epitaxial layers and a plurality of a second type of epitaxial layers. A first portion of a first layer of the second type of epitaxial layers is removed in a channel region of the fin to form an opening between a first layer of the first type of epitaxial layer and a second layer of the first type of epitaxial layer. A portion of a gate structure is then formed having a gate dielectric and a gate electrode in the opening. A dielectric material is formed abutting the portion of the gate structure.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiang, Hung-Li Taipei, TW 155 1126
Leung, Ying-Keung Hsinchu, TW 92 2096
Liu, Chia-Wen Taipei, TW 28 174
Sheu, Yi-Ming Hsinchu, TW 53 638
Wei, Huan-Sheng Taipei, TW 13 93
Wu, Chung-Cheng Hsinchu County, TW 99 1556
Wu, Zhiqiang Hsinchu County, TW 336 4900

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