Integrated circuit package system with interconnection support and method of manufacture thereof
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United States of America Patent
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Mar 8, 2011
Grant Date -
Oct 8, 2009
app pub date -
Jun 12, 2009
filing date -
Jul 29, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
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