Printed circuit board consisting of laminated substrates and electronic device comprising the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9572251
APP PUB NO 20140020941A1
SERIAL NO

13946713

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a printed circuit board consisting of laminated substrates each with a fiberglass cloth contained in its resin and with a wiring arranged onto at least one of its surfaces, wherein, in at least one of substrates provided with a wiring for transmitting a higher speed signal than that transmitted by wirings arranged onto the other substrates, a fiberglass cloth having a different property from that of the other substrates is contained.

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Patent Owner(s)

  • NEC CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanaka, Shinji Tokyo, JP 317 3351
Ueda, Akihiro Tokyo, JP 60 474

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