Plasma processing apparatus and plasma processing method

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United States of America Patent

PATENT NO 11495445
SERIAL NO

16424805

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A plasma processing apparatus includes a processing chamber where a plasma processing is performed on a workpiece, a stage, an edge ring, a shield, and a driver. The stage has a placement surface on which the workpiece is placed inside the processing chamber. The edge ring is provided around the stage so as to surround the workpiece on the placement surface. The shield is capable of shielding a portion of the surface of the edge ring from plasma generated in the processing chamber. The driver changes the area of the edge ring exposed to the plasma by moving the shield relative to the edge ring.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mizuno, Yusuke Miyagi, JP 140 1298
Uchida, Yohei Miyagi, JP 35 557

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