Decimating a three-dimensional mesh via successive self-parameterization
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United States of America Patent
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Feb 22, 2022
Grant Date -
Nov 4, 2021
app pub date -
Apr 30, 2020
filing date -
Apr 30, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
Methods, systems, and non-transitory computer readable storage media are disclosed for iteratively decimating a three-dimensional mesh utilizing successive self-parameterization. For example, the disclosed system can self-parameterize local geometries of a three-dimensional mesh using surface mappings within a two-dimensional surface mapping space. The disclosed system can collapse edges in the three-dimensional mesh to create new vertices from the collapsed edges. The disclosed system can parameterize the collapsed edges based on the surface mappings to collapse corresponding edges within the surface mapping space. The disclosed system can thus generate a decimated three-dimensional mesh by collapsing edges in the three-dimensional mesh while providing a bijective map between points in the decimated three-dimensional mesh and corresponding points in the three-dimensional mesh.
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