Solid-state imaging device and method of manufacturing said solid-state imaging device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7659136
APP PUB NO 20060252174A1
SERIAL NO

11404897

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

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Patent Owner(s)

  • FUJIFILM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hosaka, Shunichi Kanagawa, JP 12 132
Maeda, Hiroshi Kanagawa, JP 360 3166
Negishi, Yoshihisa Kanagawa, JP 25 188
Nishida, Kazuhiro Kanagawa, JP 87 991

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