Importance

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Abstract

A multi-chip type image sensor includes, a base, a plurality of sensor chips arranged on the base so as to be staggered so that adjacent sensor chips among the sensor chips partially overlap with each other in the direction perpendicular to a direction in which the sensor chips are arranged. The sensor chips are fastened to the base by an adhesive for use in die bonding. Each of the sensor chips has a plurality of light receiving elements arranged into a line at a predetermined pixel pitch Pd. Each of the sensor chip contains silicon. Therminal pins are supported on the base and electrically coupled to the sensor chips. The following formula is satisfied: Pc=Pd.times.[1+(Tc-Ta) (.alpha..sub.B -.alpha..sub.Si)] where Tc [.degree.C.] is a curing temperature of the adhesive, Ta [.degree.C.] is an environment temperature at which the image sensor is to be used, .alpha..sub.Si is a thermal expansion coefficient of each of the sensor chips comprising silicon, .alpha..sub.B is a thermal expansion coefficient of the base, and Pc is a pixel pitch at which the light receiving elements are arranged in each of the sensor chips before the adhesive is cured by die bonding.

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First Claim