Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures
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United States of America Patent
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Jan 10, 2012
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app pub date -
Nov 10, 2005
filing date -
Feb 14, 2005
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Abstract
A non-leaded integrated circuits package system is provided including etching differential height lead structures having inner leads at a paddle height, providing mold locks at the bending points of the differential height lead structures, etching an elevated paddle at a same height as the inner leads, mounting a first integrated circuit on the elevated paddle, and electrically connecting first electrical interconnects between the first integrated circuit and the inner leads.
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