Wafer positioning method and apparatus

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11978677
APP PUB NO 20220415719A1
SERIAL NO

17459164

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Abstract

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In an embodiment, a method includes: placing a wafer on an implanter platen, the wafer including alignment marks; measuring a position of the wafer by measuring positions of the alignment marks with one or more cameras; determining an angular displacement between the position of the wafer and a reference position of the wafer; and rotating the implanter platen by the angular displacement.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Huicheng Tainan, TW 233 859
Chen, Chia-Cheng Hsinchu, TW 124 756
Chen, Liang-Yin Hsinchu, TW 121 368
Yang, Chih-Kai Taipei, TW 101 562
Yeo, Yee-Chia Hsinchu, TW 432 6753

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