Ceramic electronic component
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United States of America Patent
Stats
-
Jan 30, 2001
Grant Date -
N/A
app pub date -
Jun 22, 1999
filing date -
Jun 24, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A projection 23 is formed on a connecting terminal part 22 opposing to a side surface 16 of a ceramic electronic component main body 12 in a terminal member 19 by processing the metal plate which provides this terminal member 19. This projection 23 is made to project toward the side surface 16 of the ceramic electronic component main body 12. The interval more than the predetermined dimension is reliably formed between the connecting terminal part 22 and the side surface 16 of the ceramic electronic component main body 12 by the projection 23. This prevents the solder from reaching even to the ceramic electronic component main body 12.
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