Barrier metallization in ceramic substrate for implantable medical devices
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United States of America Patent
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Nov 14, 2000
Issued Date -
N/A
app pub date -
Mar 31, 1999
filing date -
Feb 21, 1997
priority date (Note) -
Expired
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Abstract
The present invention relates to multi-layer ceramic packaging of hybrid micro-electronic devices, including those for implantable medical devices. The invention permits size reduction and design simplification in such packaging by eliminating the need for electrolytic or electroless plating, and by eliminating or substantially eliminating the shrinkage variation typically associated with surface metallization techniques.
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