Method for producing a carrier element for an IC-chip
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United States of America Patent
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-
May 16, 1989
Issued Date -
N/A
app pub date -
Jul 20, 1984
filing date -
May 20, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A carrier element suitable for production in large numbers, e.g. for incorporation in identification cards, having an integrated circuit and the connection leads and contacts necessary for the operation of the circuit. The carrier consists of a single or multilayer insulating material, e.g. a film, carrying the circuit contacted with the connection leads in punched out windows. To protect the circuit from mechanical stress the thickness of the film is greater than or at least equal to the thickness of the integrated circuit plus the thickness of the contacted connection leads.
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