Semiconductor sensor device and semiconductor sensor device manufacturing method

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United States of America Patent

PATENT NO 11404475
APP PUB NO 20200152695A1
SERIAL NO

16354816

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Connection with a wiring structure can be reliably achieved, whereby a semiconductor sensor device and a semiconductor sensor device manufacturing method with increased reliability are provided. A semiconductor sensor device in which a multiple of signal lines and a sensor detection portion are disposed includes a conductive film, disposed on a substrate, that configures the signal lines and whose upper face is exposed by an aperture portion of a width smaller than a width of the signal lines, a conductive member formed on the conductive film and electrically connected to the conductive film via the aperture portion, and a wiring structure, formed on an upper face of the conductive member, of an air bridge structure that connects the signal lines or the signal lines and the sensor detection portion, wherein an upper surface of the conductive member is in contact with the wiring structure, and a side face is exposed.

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Patent Owner(s)

  • MITSUBISHI ELECTRIC CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hosomi, Shinichi Tokyo, JP 19 208
Inoue, Hiromoto Tokyo, JP 8 85
Kawama, Yoshitatsu Tokyo, JP 10 175
Sugino, Takaki Tokyo, JP 13 31

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