Adhesive composition, adhesive sheet and production process for semiconductor device
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United States of America Patent
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Nov 30, 2010
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app pub date -
May 23, 2007
filing date -
May 23, 2006
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Abstract
The adhesive composition according to the present invention is characterized by including an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group. According to the present invention, the high package reliability can be achieved even when exposed to severe reflow conditions in a package in which a thin semiconductor chip is mounted.
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