Semiconductor device and manufacturing method thereof
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United States of America Patent
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Feb 20, 2007
Issued Date -
N/A
app pub date -
Jul 31, 2002
filing date -
Aug 1, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a semiconductor device including a plurality of thin film transistors provided on a base member having a curved surface. The surface may be bent in either a convex shape or a concave shape. All channel length directions of the plurality of thin film transistors may also be aligned in the same direction. Further, the channel length direction may be different from the direction in which the base member is bent. A pixel portion and a driver circuit portion may also be provided on the base member. The invention also includes a method of manufacturing a semiconductor device including forming a layer to be peeled including an element of a substrate, bonding a support member to the layer to be peeled, and bonding a transfer body to the layer to be peeled.
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