High speed interposer
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United States of America Patent
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Jan 25, 2011
Issued Date -
N/A
app pub date -
Jan 24, 2008
filing date -
Jun 19, 2006
priority date (Note) -
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Abstract
A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned within the openings and also extending from surface to surface (and beyond, in some embodiments), and a plurality of shielding members positioned substantially around the conductive members to provide shielding therefore during the passage of high frequency signals through the conductive members.
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