Array antenna device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11183771
APP PUB NO 20200395676A1
SERIAL NO

16638715

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Included are: a first dielectric substrate provided with a first conductor ground plane on a front or back surface thereof; a plurality of patch antennas formed in the first conductor ground plane, a plurality of conductive members, ends of which connected to the first conductor ground plane to surround the patch antennas individually, and a second conductor ground plane connected to each of the other ends of the conductive members, and parts of the plurality of conductive members penetrate the first dielectric substrate, and the remaining parts of the conductive members function as spacers for providing an air layer between the first dielectric substrate and the second conductor ground plane, and the plurality of conductive members functions as spacers for providing an air layer between the first conductor ground plane and the second conductor ground plane.

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First Claim

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Patent Owner(s)

  • MITSUBISHI ELECTRIC CORPORATION

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukasawa, Toru Tokyo, JP 48 387
Nakamoto, Narihiro Tokyo, JP 8 18
Otsuka, Masataka Tokyo, JP 20 79
Takahashi, Tomohiro Tokyo, JP 153 668
Yokokawa, Kei Tokyo, JP 7 43

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