Semiconductor devices and methods of manufacturing semiconductor devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11145638
APP PUB NO 20210082891A1
SERIAL NO

16571904

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Abstract

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An exemplary semiconductor device can comprise (a) a substrate comprising a substrate dielectric structure between the substrate top side and the substrate bottom side, conductive pads at the substrate bottom side, and a substrate cavity through the substrate dielectric structure, (b) a base electronic component comprising inner short bumps; outer short bumps bounding a perimeter around the inner short bumps, and tall bumps between the outer short bumps and an edge of the base component top side, and (c) a mounted electronic component coupled to the inner short bumps of the base electronic component. The tall bumps of the base component can be coupled to the conductive pads of the substrate. The mounted electronic component can be located in the substrate cavity. The substrate bottom side can cover at least a portion of the outer short bumps of the base electronic component. Other examples and related methods are disclosed herein.

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Patent Owner(s)

  • AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Jae Yeong Seoul, KR 3 1
Cha, Hyun Goo Incheon, KR 4 1
Cho, Sang Hyeok Gyeonggi-do, KR 3 1
Huemoeller, Ron Gilbert, US 19 190
Kang, Dong Hee Gyeonggi-do, KR 9 157
Ma, Sang Yun Incheon, KR 4 1

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