Circuit board having pad and chip package structure thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8389869
APP PUB NO 20100212948A1
SERIAL NO

12554340

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A circuit board including a substrate, a conductive pattern and a solder mask layer is provided. The conductive pattern includes a pad, a tail trace and a signal trace. The tail trace connects with the edge of the pad and the signal trace connects with the edge of the pad. An angle between a portion of the signal trace neighboring the pad and the tail trace is larger than 0 degree and smaller than 180 degree. The solder mask layer is disposed on the substrate and covers a portion of conductive pattern. The solder mask layer has an opening exposing the whole pad.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING, INC.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Ko-Wei Kaohsiung, TW 13 7

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 5, 2024
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00