Method for assembling a camera module, and camera module
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United States of America Patent
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Apr 29, 2014
Issued Date -
N/A
app pub date -
Jan 26, 2007
filing date -
Mar 22, 2006
priority date (Note) -
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Abstract
A method for manufacturing a camera module is provided, the camera module including a lens and an image sensor chip, the image sensor chip being electrically contacted to a circuit board. After a first fitting part that surrounds the image sensor chip is positioned and secured on the circuit board, the first fitting part is joined to a second fitting part disposed on the housing of the camera module, forming an overlap region. A focus position between the housing-side lens and the image sensor chip is produced, and a materially attached connection is then generated between the fitting parts within the overlap region, in the focus position.
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