Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps
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United States of America Patent
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Mar 23, 2004
Grant Date -
N/A
app pub date -
Jul 14, 2000
filing date -
Jul 14, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and an apparatus are provided for selectively depositing flux on a plurality of flip-chip bumps arranged on a semiconductor chip by jet printing a flux pattern, which is substantially identical to the arrangement pattern of the flip-chip bumps. The flux pattern is determined by measuring the chip configuration and converting the configuration to computer-recognizable data. The converted chip configuration is stored in data storage, and a jet printing head prints the flux pattern based on the computer-recognizable data. A conveyance plate is provided to transport the semiconductor chip to a flux-deposition area below the jet printing head.
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