Offset pads over TSV

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United States of America Patent

PATENT NO 11728313
APP PUB NO 20210257341A1
SERIAL NO

17246845

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Representative techniques and devices including process steps may be employed to mitigate the potential for delamination of bonded microelectronic substrates due to metal expansion at a bonding interface. For example, a metal pad may be disposed at a bonding surface of at least one of the microelectronic substrates, where the contact pad is positioned offset relative to a TSV in the substrate and electrically coupled to the TSV.

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First Claim

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Patent Owner(s)

  • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gao, Guilian San Jose, US 126 2841
Lee, Bongsub Santa Clara, US 19 382

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