Circuit board and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 1, 2011
Grant Date -
Feb 5, 2009
app pub date -
May 19, 2008
filing date -
Jul 30, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A circuit board is provided, comprising a substrate, a first conductive layer, at least one through hole, a protection layer, a plurality of contacts and a fixing element. The first conductive layer is formed on the substrate. The through hole is formed on the substrate and the first conductive layer. The protection layer is formed on the first conductive layer, wherein the protection layer comprises a plurality of hollow portions, the hollow portions surround the through hole, and the first conductive layer is exposed in the hollow portions. The contacts are disposed in the hollow portions, wherein the contacts are protruding from a surface of the protection layer. The fixing element is fixed in the through hole, wherein the fixing element contacts the contacts.
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