Arrangement of conductive pads on grid array package and on circuit board
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United States of America Patent
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May 13, 2008
Grant Date -
Apr 12, 2007
app pub date -
Oct 11, 2005
filing date -
Oct 11, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention discloses a dense arrangement in the conductors of a package and the corresponding conductive pads of a circuit board. The conductors and the corresponding conductive pads are separated into at least a first group in a peripheral region of the grid array package, and a second group in another region of the grid array package. Most in the first group of conductive pads are apart at a first pitch, most in the second group of conductive pads are apart at a second pitch which is less than the first pitch. According to the shrinking in the conductive trace on a conductive layer and the shrinking in the through hole, the first pitch and the second pitch are optimized for the maximum conductors and the corresponding conductive pads.
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