Edge plated printed circuit board
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United States of America Patent
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Aug 30, 2016
Grant Date -
Oct 1, 2015
app pub date -
Mar 25, 2014
filing date -
Mar 25, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An edge plated printed circuit board (PCB) improves radiated emission performance by enhancing ground shielding on the PCB and improving the physical and electrical connection between the PCB and external EMI suppression components including an EMI chassis and gaskets. Inner ground layers within a multi-layer PCB are configured to physically extend to an edge of the PCB, which is plated using copper electroplating, so that copper ground strips disposed at the top and bottom surfaces of the PCB and the inner ground layers are all electrically coupled to the plated edge. In some embodiments, the ground strips can be made thinner compared to conventional arrangements, or be eliminated altogether as a result of the direct connection between the edge plated PCB and external EMI shields.
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