Array substrate, display apparatus, and method of fabricating array substrate

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United States of America Patent

PATENT NO 11335712
APP PUB NO 20210408052A1
SERIAL NO

16755652

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Abstract

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An array substrate is provided. The array substrate includes a base substrate; a first bonding pad layer including a plurality of first bonding pads on a first side of the base substrate; a second bonding pad layer including a plurality of second bonding pads on a second side of the base substrate, wherein the second side is opposite to the first side; and a plurality of signal lines on a side of the second bonding pad layer away from the base substrate. A respective one of the plurality of second bonding pads extends through the base substrate to electrically connect to a respective one of the plurality of first bonding pads. The respective one of the plurality of first bonding pads includes a protruding portion protruding away from the first side of the base substrate along a direction from the second side to the first side.

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Patent Owner(s)

  • BOE TECHNOLOGY GROUP CO. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cao, Zhanfeng Beijing, CN 167 313
Di, Muxin Beijing, CN 29 21
Liang, Zhiwei Beijing, CN 55 53
Liu, Yingwei Beijing, CN 56 62
Wang, Ke Beijing, CN 370 2858
Yuan, Guangcai Beijing, CN 204 331
Zhu, Xiaoyan Beijing, CN 37 64

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