Planarization system with multiple polishing pads
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United States of America Patent
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May 13, 2003
Grant Date -
Nov 29, 2001
app pub date -
Feb 27, 2001
filing date -
Feb 29, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A chemical mechanical planarization system for planarizing wafers is provided. The system generally includes a transfer corridor, at least one corridor robot, one or more polishing modules and at least one loading device. The corridor robot is disposed in the transfer corridor and is positionable between a first end and a second end of the transfer corridor. The loading device is adapted to transfer workpieces between the transfer corridor and the polishing modules. Generally, the loading device includes at least one load cup. The one or more polishing modules each include one or more polishing heads for holding workpieces during processing.
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