Method of manufacturing a system in package
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United States of America Patent
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Jun 14, 2011
Grant Date -
Jun 11, 2009
app pub date -
Jul 18, 2006
filing date -
Jul 19, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A system in package (10) has a, preferably wireless, test controller (20) for testing each die (30) after it has been mounted onto the substrate of the system in package (10), and a faulty die (30) is repaired before a next die (30) is mounted onto the substrate (15). This way, the system in package (10) can be tested during the intermediate stages of its manufacturing, thus ensuring that all dies (30) function correctly before sealing the dies in the single package. Consequently, a method for manufacturing a system in package (10) is obtained that has an improved yield compared to known manufacturing methods.
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