Method of manufacturing semiconductor chip using laser light and plasma dicing

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Mar 15, 2011
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Jul 8, 2010
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Feb 7, 2008
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Feb 8, 2007

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can be removed in a higher efficiency and in simple steps, while the general purpose characteristic can be secured.

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PANASONIC CORPORATION

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Arita, Kiyoshi	Fukuoka, JP	54	2285
Harikai, Atsushi	Saga, JP	66	615

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Method of manufacturing semiconductor chip using laser light and plasma dicing

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United States of America Patent

12160482

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PATENT NO	7906410
APP PUB NO	20100173474A1
SERIAL NO	12160482
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 15, 2011	US,7906410,B2 US7906410B2	GRANTED PATENT AS SECOND PUBLICATION
July 08, 2010	US,20100173474,A1 US20100173474A1	FIRST PUBLISHED PATENT APPLICATION

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12160482

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