Molded direct bonded and interconnected stack

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United States of America Patent

PATENT NO 11158606
SERIAL NO

16460068

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Abstract

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Dies and/or wafers are stacked and bonded in various arrangements including stacks, and may be covered with a molding to facilitate handling, packaging, and the like. In various examples, the molding may cover more or less of a stack, to facilitate connectivity with the devices of the stack, to enhance thermal management, and so forth.

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Patent Owner(s)

  • INVENSAS BONDING TECHNOLOGIES, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gao, Guilian San Jose, US 126 2845
Haba, Belgacem Saratoga, US 721 20902
Katkar, Rajesh Milpitas, US 225 4608
Theil, Jeremy Alfred Mountain View, US 27 522
Uzoh, Cyprian Emeka San Jose, US 331 9279

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