Composition and methods for bonding electrical components
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United States of America Patent
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-
Jun 1, 1993
Grant Date -
N/A
app pub date -
Jan 24, 1990
filing date -
Jan 24, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Adhesive Compositions comprising a solid component of from about 60 to 90 percent of a solid resin and from about 10 to 40 percent flexible resin which are suspended in a liquid component comprised of from about 80 to 98 percent solvent and from about 2 to 20 percent curing agent and wherein the solid component comprises from about 10 to about 30 percent of the overall composition and the liquid component comprises about 70 to 90 percent of the overall adhesive composition can be used to 'quick tack' electrical components in minimal amounts of time and with minimal amounts of electrical resistance between the components.
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