Method of fabricating a photomask

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United States of America Patent

PATENT NO 11415876
APP PUB NO 20210181617A1
SERIAL NO

17030941

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Abstract

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The present disclosure relates to a fabrication method of a photomask. The method of fabricating a photomask provides for a layout of patterns to be designed. The layout of patterns may be formed on a wafer on which chips are formed. The layout of patterns are corrected to provide a layout of a photoresist pattern serving as an etching mask for forming the patterns on the wafer while generating a flare map of the patterns. An optical proximity correction (OPC) may be performed at a chip level on the corrected layout of patterns to perform a secondary correction of the layout of patterns. A second OPC may be performed at a level of a shot which includes a plurality of ones of the chips by reflecting the flare map on the second corrected layout of patterns to a third corrected layout of patterns.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jung, Kangmin Seoul, KR 6 19
Kwon, Youngdeok Suwon-si, KR 2 0
Noh, Myungsoo Suwon-si, KR 6 1
Park, Sangwook Hwaseong-si, KR 113 571

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