High-frequency power amplifier
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United States of America Patent
Stats
-
Feb 14, 2006
Grant Date -
Sep 9, 2004
app pub date -
Jan 14, 2004
filing date -
Mar 3, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A second strip conductor is located, in a lamination direction of a multilayer substrate, at a is different position from that of a first strip conductor. A first grounding conductor and a second grounding conductor are disposed sequentially in the lamination direction of the multilayer substrate and sandwich the first strip conductor and the second strip conductor. The first grounding conductor includes a first grounding conductor portion for a wiring prohibited area in which no wiring may be placed, and a second grounding conductor portion for an area other than the wiring prohibited area. The second grounding conductor portion is positioned, in the lamination direction of the multilayer substrate, at a location is different from that of the first grounding conductor portion.
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International Classification(s)
Cited Art Landscape
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