Bonded wafer processing method

United States of America Patent

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Oct 31, 2006
Grant Date
Sep 29, 2005
app pub date
Mar 29, 2004
filing date
Mar 29, 2004

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Expired

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Abstract

According to one embodiment a method is disclosed. The method includes applying a photoresist layer to a first wafer, etching the first wafer, bonding the first wafer to a second wafer and thinning the first wafer; wherein an unsupported bevel portion of the first wafer is removed.

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INTEL CORPORATION

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Chan, Michael Y	Portland, OR	12	273
List, R Scott	Beaverton, OR	46	4648
Morrow, Patrick	Portland, OR	218	2479

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Bonded wafer processing method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10811758

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PATENT NO	7129172
APP PUB NO	20050215056A1
SERIAL NO	10811758
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 31, 2006	US,7129172,B2 US7129172B2	GRANTED PATENT AS SECOND PUBLICATION
September 29, 2005	US,20050215056,A1 US20050215056A1	FIRST PUBLISHED PATENT APPLICATION

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10811758

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