Optical die-down quad flat non-leaded package
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United States of America Patent
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Feb 24, 2009
Issued Date -
N/A
app pub date -
May 5, 2006
filing date -
May 5, 2005
priority date (Note) -
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Abstract
An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead frame die paddle (pad), and light passes from outside the package through the opening in the lead frame die pad onto light collection elements on the active side of the chip.
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