Folded leadframe multiple die package

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United States of America Patent

PATENT NO 8508025
APP PUB NO 20120241930A1
SERIAL NO

13492074

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Abstract

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A multiple die package includes a folded leadframe for interconnecting at least two die attached to another leadframe. In a synchronous voltage regulator the folded leadframe, which is formed from a single piece of material, connects the high side switching device with the low side switching device to provide a low resistance, low inductance connection between the two devices.

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Patent Owner(s)

  • FAIRCHILD SEMICONDUCTOR CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Yong Scarborough, US 1104 23151
Maldo, Tiburcio A Suzhou, CN 17 86
Yang, Hua Suzhou, CN 234 2171

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