Singulation method used in leadless packaging process
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United States of America Patent
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Apr 17, 2007
Issued Date -
N/A
app pub date -
Jun 29, 2004
filing date -
Aug 15, 2003
priority date (Note) -
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Abstract
A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of the lead frame is attached with a tape. Each of the molded products includes a semiconductor chip encapsulated in a package body and electrically coupled to the upper surface of the lead frame. The singulation method is accomplished by etching the upper surface of the lead frame with the package bodies as mask until each dambar is etched away.
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