Package and semiconductor device
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United States of America Patent
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Oct 26, 2021
Grant Date -
Aug 6, 2020
app pub date -
Apr 23, 2020
filing date -
Nov 14, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A package includes a base substrate, a frame, and a lead frame. The base substrate is made of metal, and includes a mounting area on which a semiconductor element is to be mounted and a frame area surrounding the mounting area. The frame is provided on the frame area of the base substrate, and includes a first surface facing the frame area and a second surface opposite to the first surface. The lead frame is joined to the second surface of the frame. The frame includes a plurality of dielectric layers having a layered structure and an element connector to be electrically connected to the semiconductor element. The plurality of dielectric layers include a first dielectric layer having first permittivity and a second dielectric layer having second permittivity different from the first permittivity.
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