Method and system for printing specific print zones using a bundled print head shuttle assembly
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United States of America Patent
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-
Jul 8, 2003
Grant Date -
May 15, 2003
app pub date -
Nov 9, 2001
filing date -
Nov 9, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and system for printing specific print zones of a substrate is described. A bundled shuttle print head assembly is utilized to print desired print zones of a substrate in a single pass while the substrate is stationary in a stopped position.
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