Method for producing lens elements and packaged radiation-sensitive devices on wafer level

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United States of America Patent

PATENT NO 11815699
SERIAL NO

16595901

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Abstract

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A production method includes fixing ball elements of a semiconductor material to a carrier substrate by means of heat and pressure; and one-sided thinning of the ball elements fixed to the carrier substrate to form plano-convex lens elements of a semiconductor material.

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Patent Owner(s)

  • FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kulkarni, Amit Hamburg, DE 82 1325
Laske, Norman Bokelrehm, DE 1 0
Quenzer, Hans-Joachim Itzehoe, DE 24 269
Schulz-Walsemann, Arne Veit Oldenborstel, DE 1 0
Stenchly, Vanessa Meldorf, DE 5 8

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