Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

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United States of America Patent

PATENT NO 11594509
APP PUB NO 20210159203A1
SERIAL NO

17164217

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Abstract

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A method to produce a semiconductor package or system-on-flex package comprising bonding structures for connecting IC/chips to fine pitch circuitry using a solid state diffusion bonding is disclosed. A plurality of traces is formed on a substrate, each respective trace comprising five different conductive materials having different melting points and plastic deformation properties, which are optimized for both diffusion bonding of chips and soldering of passives components.

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Patent Owner(s)

  • COMPASS TECHNOLOGY COMPANY LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheung, Chee Wah Hong Kong, HK 23 68
Pun, Kelvin Po Leung Hong Kong, HK 21 30

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