Microelectronic substrate including embedded components and spacer layer and method of forming same
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United States of America Patent
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Oct 5, 2010
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app pub date -
Dec 11, 2006
filing date -
Dec 11, 2006
priority date (Note) -
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Abstract
A microelectronic substrate, a method of forming the same, and a system including the same. The microelectronic substrate comprises: a conductive layer; a spacer layer disposed onto the conductive dielectric layer; a dielectric build-up layer disposed onto the spacer layer, the spacer layer being made of a material that has a lower shrinkage than a material of the embedding dielectric-build-up layer during curing, and a higher viscosity than a material of the embedding dielectric build-up layer in its pre-cure form and during curing; and active or passive microelectronic components embedded within the dielectric build-up layer.
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