Semiconductor device and method for fabricating the same

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United States of America Patent

PATENT NO 11778922
SERIAL NO

17533003

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Abstract

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A method for fabricating semiconductor device includes first forming a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate, performing an atomic layer deposition (ALD) process or a high-density plasma (HDP) process to form a passivation layer on the first MTJ and the second MTJ, performing an etching process to remove the passivation layer adjacent to the first MTJ and the second MTJ, and then forming an ultra low-k (ULK) dielectric layer on the passivation layer.

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Patent Owner(s)

  • UNITED MICROELECTRONICS CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chun-Lung Tainan, TW 125 790
Gao, Wei-Xin Tainan, TW 14 1
Hou, Tai-Cheng Tainan, TW 23 1
Hsieh, Chin-Yang Tainan, TW 41 66
Huang, Wei-Hao New Taipei, TW 52 185
Jhang, Jing-Yin Tainan, TW 64 72
Lai, Yu-Tsung Tainan, TW 53 227
Li, Chih-Yueh Taipei, TW 28 84
Li, Kun-Ju Tainan, TW 47 67
Liao, Kun-Yuan Hsinchu, TW 50 246
Lu, Chia-Lin Taoyuan, TW 59 283
Tsai, Bin-Siang Changhua County, TW 84 58
Tsai, Fu-Yu Tainan, TW 48 58
Wang, Hui-Lin Taipei, TW 109 119
Weng, Chen-Yi New Taipei, TW 64 122

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