Void-free high aspect ratio metal alloy interconnects and method of manufacture using a solvent-based etchant

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United States of America Patent

PATENT NO 11443983
SERIAL NO

16139241

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An integrated circuit structure comprises a dielectric layer on a substrate. An open structure is in the dielectric layer, and a void-free metal-alloy interconnect is formed in the open structure, wherein the void-free metal-alloy interconnect comprise a metal-alloy comprising a combination of two or more metallic elements excluding any mixing effects of a seed layer or liner deposited in the open structure prior to a metal fill material, and excluding effects of any doping material on the metal fill material.

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Patent Owner(s)

  • INTEL CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chowdhury, Shaestagir Portland, US 10 101
Saha, Biswadeep Beaverton, US 1 2
Surawanvijit, Sirikarn Portland, US 2 6
Thompson, Erica J Beaverton, US 8 26

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