Monolithic polyimide laminate containing encapsulated design and preparation thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 5, 2000
Grant Date -
N/A
app pub date -
Apr 9, 1998
filing date -
Apr 9, 1998
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A monolithic polyimide laminate without joints or seams, formed from polyimide layers containing from 400 to 10,000 ppm of tin without the use of an adhesive, and containing an encapsulated image design consisting of flow channels, ports, passageways, openings and windows for providing uninhibited flow of gases and/or fluids.
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Cited Art Landscape
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