LED package with surface textures and methods of formation

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11217735
APP PUB NO 20160247984A1
SERIAL NO

14627993

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Importance

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Abstract

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Methods and apparatus are provided for LED packages with surface textures. In one novel aspect, microstructures are formed on surfaces of the LED package such that light extract efficiency is improved. In one embodiment, the LED package has a silicone-encapsulating layer scattered with phosphors. In another embodiment, the LED package has a leadframe substrate. The microstructure can be micro lens, micro dents, micro pillars, micro cones, or other shapes. The microstructures can be periodically arranged or randomly arranged. In one novel aspect, the compression molding process is used to form rough surfaces. The molding block or the release film is modified with microstructures. In another novel aspect, sandblasting process is used. In one embodiment, microstructures are formed on sidewalls using the sandblasting process. The hardness, the angle, and/or the size of the blasting media are selected to improve the efficiency of the LED package.

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Patent Owner(s)

  • LUMINUS, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Saijin San Jose, US 29 117
Ma, Hongtao Campbell, US 41 215
Tong, Tao Fremont, US 68 1576

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