Linking to chemical array assemblies with metal layers
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United States of America Patent
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Oct 31, 2006
Grant Date -
Apr 22, 2004
app pub date -
Oct 21, 2002
filing date -
Oct 21, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of producing a front surface modified substrate, which substrate includes a metal layer, and which is useful in the fabrication of an array of multiple probes bonded to a front surface of a substrate at different features of the array. The method includes providing the substrate wherein the front surface displays functional groups. The front surface is contacted with linker molecules each having a group which binds the linker molecule to the front surface following a reaction with a surface displayed functional group, which reaction does not produce a reagent which attacks the metal layer. To fabricate an array the front surface may be contacted with the probes or probe precursors to bind the probes or probe precursors to the front surface bound linker molecules.
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