Bonding an interconnect to a circuit device and related devices

United States of America Patent

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May 18, 2010
Grant Date
Oct 13, 2005
app pub date
Apr 8, 2004
filing date
Apr 8, 2004

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Expired

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Abstract

This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.

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Patent Owner(s)

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

International Classification(s)

H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hellekson, Ronald	Eugene, US	1	5
Meyer, Neal	Corvallis, US	10	272
Yenchik, Ronnie	Blodgett, US	1	5

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Bonding an interconnect to a circuit device and related devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10822064

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PATENT NO	7716823
APP PUB NO	20050223552A1
SERIAL NO	10822064
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 18, 2010	US,7716823,B2 US7716823B2	GRANTED PATENT AS SECOND PUBLICATION
October 13, 2005	US,20050223552,A1 US20050223552A1	FIRST PUBLISHED PATENT APPLICATION

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10822064

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