Method of electrodepositing metal on electrically conducting particles
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United States of America Patent
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Aug 13, 2002
Issued Date -
N/A
app pub date -
May 16, 2000
filing date -
May 16, 2000
priority date (Note) -
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Abstract
The present invention relates to a device and method for electrolytic deposition of metals on conducting particles. The conducting particles are completely immersed in a liquid and allowed to flow across a particle contacting surface of a cathode support. The particles flow across the surface and into a reservoir. Electrical contact is made between the negative pole of a DC power supply and the conducting particles. An anode mesh is placed above and parallel to the top face of the particle bed such that the mesh does not touch the particle bed but remains a controlled distance from it. The anode mesh is connected to the positive terminal of the DC power supply. A significant aspect of the present invention is that the device does not require a separator between the particle bed and the anode.
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